Yong Ling Chan
Summary
- Product and test engineer with over 18 years of experience in backend manufacturing , product testing and product development.
- Analytical product engineer focused on applying sound engineering principles using both traditional and innovative methods.
- Background includes engineering support for product planning, testing and release. Knowledgeable about documentation, test program and production requirements.
Overview
19
19
years of professional experience
Work History
MTS Staff Engineer , Product Engineering
AMD-Xilinx Asia Pacific Pte. Ltd.
05.2022 - Current
- Has ownership over FGPA wafer sort and final test program releases and product evaluation activities
- Negotiated contracts with vendors strategically, securing favorable terms that contributed to cost savings for the company.
- Scoped project timelines accurately by leveraging strong analytical skills, enabling successful delivery within deadlines.
- Provide engineering support for a smooth and rapid agile operation business ramp
- Own and drive product quality through continuous improvement
- Interact with internal cross functional groups on all product issues such as customer return, coverage improvements and custom design application
- Manage product cost reduction through test yield improvement projects, test time reduction and capacity expansion
- Drive wafer sort and final test correlation, yield analysis and corrective actions
- Problem Solving through rootcause analysis, data mining and Statistical modelling.
- Improved project efficiency by streamlining communication between team members and stakeholders.
- Designed and implemented innovative solutions for complex engineering problems, resulting in increased productivity.
- Collaborated with cross-functional teams to develop integrated systems, optimizing overall performance.
Staff Engineer , Product Engineering
Marvell Asia Pte Ltd
01.2022 - 05.2022
- Support new product introduction initial phase to validate new device features and test/DFT methodologies
- Perform new device characterization, circuit sensitivity analysis, interpret findings & support root-cause investigations
- Perform data mining and statistical data analysis on wafer sort and final test parametric to support initial product assessment
- Support product assessment report generation
- Perform functional testing and analysis to ensure product operation and reliability
- Support & resolve Test engineering & program related issues
- Support volume Engineering sample supply for early customer engagement
- Plan and coordinate (data analysis, debug, root-cause, implementing solutions) yield & test time improvement activities to meet the set mass production release goals
- Provide customer return verification support including implement containment & preventive actions
- Execute and implement test productivity activities which include test time reduction, retest reduction, test insertion removal, higher parallelism
- Transfer product knowledge to sustaining engineer
- Engage & manage Test Subcon in early production stage.
Senior Product Test Engineer
Infineonn Technologies Asia Pacific Pte Ltd
01.2012 - 01.2022
- Managing a group of technician to support daily routine tasks and engineering activities
- Collaborated with cross-functional teams to ensure seamless product development and launch.
- Optimized test plans, resulting in reduced time-to-market for new products.
- Lead and drive product cycle from new product to mass production
- Liase with manufacturing and business units to ramp product into volume production at acceptable yield
- Release new test program and hardware to production
- Responsible in documentation, eg process control spec
- Identify and implement productivity improvement and cost reduction projects
- Provide technical support to production at final or wafer testing
- Test Program optimization together with test developer to reduce test time and yield improvement
- Perform product performance analysis with analysis tools ( eg corner stone, failure analysis methodology)
- Risk assessment on low yield lots and disposition given to manufacturing.
Product Test Engineer
United Test and Assembly Center Ltd
04.2007 - 11.2011
- Co-ordinate and qualify product testing activities to meet customers’ requirements
- Led root cause analysis investigations to identify solutions for complex technical issues encountered during testing.
- Test process improvement, flow simplification, test time reduction and test solution to enhance productivity
- Test program and hardware fixture development and/or conversion
- Provide OJT for Manufacturing Operators and Technicians
- Involved in test and burn-in yield improvement activities
- Involved in manufacturing support activities to minimize downtime
- Handle equipment qualification and release to Production
- Prepare engineering reports and manage data.
Service Engineer
ELV products marketing PTE LTD
07.2006 - 02.2007
- Responsibilities: Responsible in maintenance of company products and those bought in by customers
- Coordinated with development engineer in design and development
- Developed and improved designed project
- Installation of company products upon customers’ request
- Provide engineering expertise in supporting product setup and failure analysis.
Assitant Engineer/trainee
Cubi Creative Electronics Sdn Bhd
10.2005 - 01.2006
- Responsibilities: Assists engineer or technician in manufacturing department
- Debugging and repair failure product
- Product testing
- Achievements: Debugged few types of MP3 players
Education
Bachelor of Engineering (Electrical/Electronic) (Telecommunication) -
Multimedia University(Telekom University)
Malaysia01.2006
Skills
- JMP
- Statistical Data Analysis
- People management
- Advantest tester (T5581 & T5593)
- Verigy 93k
- Teradyne J750 and Flex
- Microsoft Office applications
- Visual Basic
- C Language
- UNIX & Perl
- Java
Accomplishments
- Up to 11% test time reduction in wafer sort by release new TP to production.
- Up to 55% test time reduction in final test
- Improve site2 yield up to 5.4% by update the func freq of all rdbk freq.
- The solution is to lower all rdbk test func freq from 100MHz to 75 MHz to have robust testing regardless the hardware variation.
- Assign routine tasks to respective technician to perform.
- Optimize the test efficiency by minimize index time between tests.
- Various product ambient test removal in costs and cycle time saving ( ~20% overall).
- OEE improvement up to ~20% through different handler migration (Rasco to Multitest handler)
- Involve of tester upgrade qualification to reduce up to 15% test time.
- Involve in product transfer and qualification from Batam and Malacca sites.
- Provide product knowledge training to other sites engineers.
- Engine power management IC (during 2012)
- Intel 3G mobile chip (starting from March 2011)
- DRAM DDR TSOP66 & SDR TSOP 54 – new type of wafer (during Nov 2009- August 2010)
- DRAM DDR2 LBGA 2GB and DDR2 WCSP 1GB (during 2008-2009)
- DRAM SDR TSOP54 128MB (during 2007)
- Assembly wire bonding 0.8 mil FT evaluation to reduce material used in wire bond process. (Feb 2009)
- E-fuse x4 wire bonding to x8 project to increase flexibility of product output. (March 2009)
- Long life capillary evaluation for QIT cost down project. (March 2009)
- Different type of solder ball FT evaluation. (April 2009)
- 0.7 mil & 0.9 mil wire bonding evaluation. (June 2009)
- Retention DOE evaluation to achieve lower retention failure (estimated <1 %). (Jan 2009)
- Achieved pretest rate < 0.3% in weekly yield monitoring due to product delam issue. (Feb 2009)
- TSOP66 devices pins bridging test sorting 13 affected lots (total ~155k). (May 2009)
- Evaluation of DDR2 LBGA qualified testers to resolve high temp low yield issue, improving yield from 97% to 98.5% averagely (June 2009)
- Achieved TSOP66 Shank angle test sorting which involved ~245k (60 lots). (June 2009)
- Assembly step cut (process improvement) FT evaluation. (Dec 2009)
AMD (formerly Xilinix) Staff engineer,Product Engineering
WS test time reduction program release
FT test time reduction program release
Product WS test site to site low yield Issue
Infineon product test yield engineer
Managing a group of technician since 2019.
Test Package optimization.
Test Insertion Reduction
Platform Migration
Product transfer from other sites
UTAC product test engineer for Memory/Mixed Signal and Logic products)
New product qualification
Cost reduction evaluation project
Product quality/yield improvement activities:
Languages
Bahasa Malaysia
English
Japanese
Mandarin
Timeline
MTS Staff Engineer , Product Engineering
AMD-Xilinx Asia Pacific Pte. Ltd.
05.2022 - Current
Staff Engineer , Product Engineering
Marvell Asia Pte Ltd
01.2022 - 05.2022
Senior Product Test Engineer
Infineonn Technologies Asia Pacific Pte Ltd
01.2012 - 01.2022
Product Test Engineer
United Test and Assembly Center Ltd
04.2007 - 11.2011
Service Engineer
ELV products marketing PTE LTD
07.2006 - 02.2007
Assitant Engineer/trainee
Cubi Creative Electronics Sdn Bhd
10.2005 - 01.2006
Bachelor of Engineering (Electrical/Electronic) (Telecommunication) -
Multimedia University(Telekom University)
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