Summary
Overview
Work History
Education
Skills
Accomplishments
Parttimeexperience
Telno
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Personal Information
Additional Information
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Tharmanesan Subramaniam

Tharmanesan Subramaniam

Engineering Manager
Sungai Bakap

Summary



Professional Summary

Highly experienced semiconductor engineering professional with over 25 years of expertise in engineering, manufacturing control, and assembly enhancement. Proficient in specification engineering, documentation, and reliability, with a proven track record in R&D, quality testing, and factory validation. Currently pursuing a PhD in Business Administration, holding a master’s degree in management, and a bachelor’s degree in electrical and Electronic Engineering. Demonstrated leadership, analytical problem-solving, and strategic management skills, along with extensive knowledge of advanced SPC techniques, DOE, and Response Surface Methodology. Adept in managing design, quality, validation, procurement, and technical documentation in compliance with ISO standards. Experienced in non-conformance resolution, customer audits, and advanced electronics troubleshooting in equipment and software.


Professional Objective

To leverage my extensive experience and advanced education in semiconductor engineering and management to lead and innovate in a dynamic engineering or manufacturing role. Aiming to apply my skills in leadership, analytical problem-solving, and strategic management to drive excellence in quality, reliability, and process optimization within a forward-thinking organization. Seeking opportunities to contribute to cutting-edge R&D initiatives, enhance manufacturing processes, and deliver superior technical solutions in alignment with industry standards and business objectives.

Overview

22
22
years of professional experience
1
1
Language

Work History

RD Costing Manager

LUMILEDS Sdn Bhd
2 2022 - 2 2023
  • Design and prepare budget and estimate project base for Project Development Engineering Department
  • Preparing BOM cost following TTI, ARROW, FUTURE ELECTRONICS, AVNET MOUSER and DIGIKEY & ELEMENT 14 cost calculation according to BOM cost reduction
  • Initiate and perform tenders for Raw Material, Packaging Material, Chemical, Electrical components
  • Prepare Tender results brief with recommendations
  • Identify cost improvement plans and potential projects for holistic and collective win – spearhead and track implementation of cost savings
  • Support and ensure new product launch/re-launch projects ensuring AHP meets all criteria/projects deadlines
  • Actively participate in project meetings/teleconferences
  • Contract negotiations with suppliers
  • Authorization of contracts and invoices in the systems as per schedule of authority
  • Quarterly prices update for all items using Part Analytic software
  • Ensure capacity sufficiency and capability building at vendors as per business needs
  • Bidding price reduction as Automotive customers or manufacturers to win business technique
  • Winning technique base on price reduction used
  • Preparing cost estimation of the repairing in electronics BOM for PCBA Driver for Build to print or redesign circuits
  • Responsible for ALTIIUM GERBER preparation for customer schematic in software used
  • Preparing components list in the PCB according customer schematics
  • Preparing BOM cost following DIGIKEY, MOUSER and ELEMENT 14 cost calculation.

Test Manager Test Engineering Department

Dialight Sdn Bhd
12.2018 - 02.2020
  • Debug and testing power supply for Solid State Lighting (SSL) for Engineering Department
  • Provide training and guideline to new engineers/technicians of debug jobs
  • Setup an electronics validation method for Burn In Test, Electrical Test and Hi Pot grounding test according to customer requirement
  • Measuring Strain force measurement for power supply PCBA during screw to casting body
  • Using data logger for burn in failure trip occurred by measuring earth leakage current
  • Replace component that fault in PCBA according to IPC610 Well knowledge of soldering pin through hole and SMD technology changing component during debug failure boards
  • Able to understand and redesign circuit of LED driver in AC 277 to DC schematic
  • XMC 4200 Infineon Microchip program and Lumen coding program installation and setup in driver for improved version with better control hexadecimal coding files
  • Microchip MP Lab microchip program software update for lower version coding system
  • Flashing the XMC 4200 program, coding new system and setup LED Lumen according software basis control
  • Microchip micro-controller PIC16F1934 and PIC16F1827 for LED drivers in Bulkhead and Stainless-Steel Linear drivers
  • Expert knowledge in software version updates, Java scripts for Lumen and XMC program
  • LED lamps lumen measurement using goniometers
  • Introducing new Reliant Lamps with DALI Interface software and sensor interface for SSL Lamps
  • Installation Dali software and Wireless software control lamps
  • Electrical testing at different voltage and current measurement using Chroma system
  • Prepare jig and fixture for testing PCBA completed
  • Provide optical inspection method
  • Introducing GRP Linear LED lamps with new communication Wi-Fi system
  • NPI project basis introduction inside production line
  • Completed many NPI project basis
  • Knowledge in signal generator, oscilloscopes, power supplies and multi-meter and measuring all signal from PCBA of power supply
  • Lead the engineering team in production, maintenance, and process team in evaluation
  • Functional test setup for incoming PCBA
  • Identify root-cause for failure boards
  • All batteries version lamps using Lithium rechargeable need modification in firmware are optimized after debug the software version and test method version
  • Good knowledge in microcontroller from Infineon and Microchip for software/firmware installation, setup and debug firmware
  • Responsible for development project, including schedule, resources, risk management and budget to ensure successful LED lamp project release
  • Repairing AC circuit and DC circuit component damaged by testing and verifying electronics
  • Deciding the failure power supply to be repairable and reuse back different driver according to frequency and PWM signal characteristic
  • Sanmina/Nation Gate/Oppulant PCBA and light engine checking and buy-off product
  • Replace component that fault in PCBA according to IPC610 Well knowledge of soldering pin through hole and SMD technology changing component during debug failure boards
  • Solder paste cost calculation
  • PCB price decision according layer used with ENIG finger PCB Replace component that faulty in PCBA according to IPC610
  • Altium software conversion to CAM version vice versa to test and validate Gerber file
  • Selecting suitable PBC material according to design such as Polyamide, Nelco 4009, Aluminum substrate, FR4 and Roger PCB
  • Propose PCB stacking design according to complexity of circuits to customers
  • Knowledge in reliability
  • Deciding customer Gerber need modification or comply to working gerber file
  • Prepare stencil design fiducial point reference to paste printing machine, chip mounter JUKI KE-2060RL for HAST board preparation
  • Calculate Stencil price using plastic material actual stencil price
  • Fit the PCB printing machine Juki, MPM
  • Well establish MI components and selective soldering AST machines according customer requirement.

Assistant Electronics Manager

Automotive Lighting Engineering (R&D ENGINEERING)
11.2012 - 11.2018
  • Design and Validation Electronics Department (EEV) Department for Engineering Application Department
  • Responsible for LED driver of car headlamp and rearlamp design
  • Deciding the suitable current driver according to design current level and configuration
  • Resistor base, constant current and switching of frequency and PWM
  • Preparing cost estimation of the Request For Quotation (RFQ) in electronics BOM
  • Provide training and guideline to new engineers of design and application jobs
  • Setup an electronics validation Lab for design done according to customer requirement (Electronics Engineering Validation Lab facilities)
  • Planning for validation test for Vertical Aiming Control (VAC) in Headlamp system in simple electronics system
  • Preparing new specification, purchasing order and quotation to PCBA supplier
  • Fully in charge for design DFMEA, cost impact and reliability on each project
  • Troubleshooting of testing and customer feedback in electronics design in PCBA level
  • Conduct PCBA headlamp and car level testing on EMC and EMI according customer requirement/CISPR25 Automotive Standard
  • Develop Electronics Control Unit (ECU) for headlamp and overall system interface in the car system electronic as customer specification in LIN/CAN communication
  • Simulation of schematics prepared in Cadence for correct current level in circuit of LED used in headlamps or rearlamps system
  • Select LED suitable of each function used either rear lamp, daytime running light or position low beam or high beam according to current level and LED bin level
  • Designing driver base on function either resistor base, constant current or switching driver depends on the cost, customer requirement during RFQ
  • Solving all the electronics PCBA problem of customer returns, production issue and design stage
  • Simplify electronics as cost saving VAVE
  • Fully responsible for DFMEA with OES
  • Validation test for all PCB build by OES (Original Electronics Supplier) according to customer specification following regulation of IPC63
  • EMC test according to customer specification follow each regulation described in standard
  • Validation of electronics and mechanical testing according to JASO and ECE regulations automotive requirement and thermal PCBA and validation all the customer specified specification according to specification
  • AL Check electronics interface to headlamp system to troubleshoot electronics problem via CAN/LIN communication
  • AL Checkbox troubleshoot modular level electronics problem in PCBA level with electronics system
  • Fully in charge of EMC Test List (CISPR25) as below: Radiated Emission, Conductive Emission, Bulk Current Injection, Load Dump Test, Transient Voltage Test, Electrostatic Discharge Test (ESD), Electromagnetic Immunity Test
  • Fully in charge of Electronics Test List as below: Overvoltage Test, Supply Voltage Fluctuation, Engine ignition Test, Reverse Polarity Test, Jumper Cable Test
  • Mechanical Related test (PCBA Module): Temperature cycle Test, Leakage Test, High Temperature Operating Test, Low Temperature Operating Test, High temperature Expose Test, Solder Resistance To Thermal Shock in PCBA, Dew Formation Test in PCBA, Thermal Humidity Cycle Test in PCBA, Thermal Shock Test PCBA, Junction temperature measurement of LED, Salt spray in PCBA
  • Conduct full electronics EMI/EMC testing according customer specification
  • Validate testing in environmental and electrical/electronics according automotive standard of customer PROTON, PERODUA, HONDA, SUZUKI and GENERAL MOTORS (GM)
  • Junction Temperature of LED used measurement for all design built
  • ECU (Electronics Control Unit) testing and setup AL Check in the lab
  • LSU (Light source Unit) using multiple chip of LED as Low beam and High beam development in PERODUA D20N project
  • Fully understand of LED optics requirement in projection and reflection of LED used in design headlamps and rearlamps
  • Ensure IATF 16949 compliance in all R&D activity in electronics test and design
  • Review 8D for root cause on failed electronics in the field, implementation of corrective action and prevention action
  • Excellent understanding of validation regulation of automotive according IATF 16949
  • Mold simulation for housing and sub-parts in headlamps using injection molding
  • Audit and verify injection molding departments
  • Transfer project basis for all electronics activity from Germany, China and Italy Automotive lighting projects.

Senior Staff Process Semiconductor

UNISEM (M) Bhd
12.1997 - 05.2012
  • Molding Department for semiconductor manufacturing environment
  • Responsible for process of below packages SLP/QFN, TSSOP, MSOP, PDIP, SOIC, SOT/TSOT, SC70, MW6, SCT598, TO263/TO220 & FLIP CHIP
  • Automold & Transfer Molding (HANMI, FICO, and DAICHI GP PRO 8 mold system)
  • X-Ray Operation and data monitoring in molding process
  • Improve yield and quality
  • Carry Out DOE (Design OF Experiment) for Molding Process in package reliability & quality for packages by experiments
  • Engineering Run and Qual Run from customers using plasma cleaning for delamination improvement
  • Buy-Off machines capability and implementation, in new phase III in Unisem For QFN Package and all High Density package
  • Full Responsible for SPC, FMEA, Technical Reports, Yield and Quality of all packages
  • OEE Team Leader In Cycle Time and Machine Improvement Project
  • Improved cycle time and UPH for production and package development program
  • In charge of the EOL equipment and process evaluation project
  • In charge for new leadframe type such as First Article Inspection leadframe and qualification
  • Liaison to Failure Analysis group for any extremely low yield lots to view any die cracks or bonding defects and reliability improvement
  • Liaising with packaging design engineer on the leadframe design, material used, build of material such as compound selection to comply and conform MSL level for the packages
  • Liaising with vendor such as TOWA, ASM, SUMITOMO, NITTO DENKO, HANMI, SUNYANG on the mold design and process improvement
  • Planning and characterization for implementing e-SPC project in Mold operation
  • Leading and completed 7 OEE projects which improved yield and UPH of machines under TPM
  • E-SPC coordinator for mold operation compile input to vendor design the program on mold cleaning data, nP chart, x bar R chart and downtime recording
  • Respond and resolved customer complaint using 8-D technique
  • Implementing and sourcing cost saving project for mold operation using rubber sheet cleaning
  • E-FMEA setup using software for Failure Mode Effect Analysis in mold operation.

Education

Phd in Doctorate of Business Managenet (DBA)

OPEN UNVERSITY MALAYSIA
Seberang Jaya, Penang, Malaysia

MBA - MASTER OF MANAGEMENT (MM)

OPEN UNVERSITY MALAYSIA
Seberang Jaya, Penang, Malaysia
04.2001 -

B Eng. Hons. (Electrical/Electronics Engineering) - Electrical And Electronics Engineering

University Technology Malaysia,
Johor Darul Takzim, Malaysia
04.2001 -

Skills

  • Cost Variance Analysis
  • Operational Efficiency
  • Pricing Strategy Development
  • Lean manufacturing principles

Accomplishments

  • 2022 - 2025, OPEN UNVERSITY MALAYSIA, Phd in Doctorate of Business Managenet (DBA)-Ongoing
  • 2017 - 2019, OPEN UNVERSITY MALAYSIA, MASTER OF MANAGEMENT (MM), 3.52/4.00, Wrote Thesis entitled : (Manufacturing Capabilities And Business Performance In Manufacturing Industries In Malaysia)
  • 1992 - 1997, University Technology Malaysia, Degree in Electrical Engineering, Wrote Thesis entitled : Fuzzy Logic Processor Chip (Artificial Intelligence Concept Design work on PSPICE and Mentor Graphic Digital Signal Simulation)

Parttimeexperience

Jan 2002 - Dec 2007, University Technology Petronas, Physics, Laboratories Physics, BIT Lecturer for electronics engineering students

Telno

04-5850830, 019-5709743, 0165571830

Nricno

730118-07-5599 (A 2429996)

Heightweight

1.70 m - 78 kg

Kwspsocso

12059046 & Z5968771V

Incometax

SG1164440-00

Personal Information

  • Age: 50
  • Place of Birth: Hospital Sg. Bakap, Penang
  • Salary: RM10,700
  • Expected Salary: RM14,500
  • Health Status: Excellent
  • Date of Birth: 01/18/73
  • Gender: Male
  • Nationality: Malaysian
  • Marital Status: Married

Additional Information

  • Technical Expertise:Deep understanding of semiconductor devices, fabrication processes, and materials.
    Knowledge of electronic circuit design, microelectronics, and integrated circuits.
  • Leadership Skills:Proven ability to lead and develop high-performing engineering teams.
    Strong decision-making and problem-solving skills.
  • Project Management:Proficiency in project management tools and methodologies.
    Experience in managing complex engineering projects with multiple stakeholders.
  • Communication Skills:Excellent verbal and written communication skills.
    Ability to communicate technical concepts to non-technical stakeholders.
  • Analytical Skills:Strong analytical and critical thinking abilities.
    Capability to use data analysis tools and methodologies to drive process improvements.
  • Adaptability:Ability to adapt to rapidly changing technologies and market conditions.
    Openness to continuous learning and development.


Timeline

Test Manager Test Engineering Department

Dialight Sdn Bhd
12.2018 - 02.2020

Assistant Electronics Manager

Automotive Lighting Engineering (R&D ENGINEERING)
11.2012 - 11.2018

MBA - MASTER OF MANAGEMENT (MM)

OPEN UNVERSITY MALAYSIA
04.2001 -

B Eng. Hons. (Electrical/Electronics Engineering) - Electrical And Electronics Engineering

University Technology Malaysia,
04.2001 -

Senior Staff Process Semiconductor

UNISEM (M) Bhd
12.1997 - 05.2012

RD Costing Manager

LUMILEDS Sdn Bhd
2 2022 - 2 2023

Phd in Doctorate of Business Managenet (DBA)

OPEN UNVERSITY MALAYSIA
Tharmanesan SubramaniamEngineering Manager