Noppadon Raopattananon

- Led a team of production supervisors and operators for Sensor, T/SSOP, SOL and Stick Pkg, overseeing all aspects of production processes.
- Developed and executed production plans to meet customer demand while ensuring compliance with quality standards and delivery plan.
- Responsible for daily operations and output (efficiency, delivery, quality, cost, productivity, safety, ethics).
- Collaborated with engineering and supply chain teams to identify process improvement opportunities and streamline workflows (automation, productivity, cost, etc)
- Collaborated with F&A and operation team for budget planning and execution.

- Led a team of production supervisors and operators for SO Pkg, overseeing all aspects of production processes.
- Developed and executed production plans to meet customer demand while ensuring compliance with quality standards and delivery plan.
- Responsible for daily operations and output (efficiency, delivery, quality, cost, productivity, safety, ethics).
- Collaborated with engineering and supply chain teams to identify process improvement opportunities and streamline workflows (productivity, cost, etc).
- Led the automation project for assembly team.
- Collaborated with F&A and operation team for budget planning and execution.

• Assembly process engineer focusing on die bonder, and chip coat process for SO and TSSOP pkg.
• Die bonder process engineer team leader for SO pkg.
• NPI Assembly for SO and SENSOR pkg.
• Provided technical assistance to production team when issues arose.
• Evaluated new technologies and equipment upgrades to enhance overall process capabilities, ensuring market competitiveness.
• Optimized manufacturing processes by implementing continuous improvement initiatives and lean methodologies.
• Ensured smooth integration of new products into existing systems by providing technical support to process engineer and production team.

· Contact directly to foreign customers to install new production line in Thailand.

· Experience in Die and Wire Bonding Machine with Palomar, Die Bonder Model 8000 and KnS Automatic Wire Bonder respectively.

· Laser alignment for receiver and transmitter module.