Summary
Overview
Work History
Education
Skills
Personal Information
Certification
Philanthropic
Timeline
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TAN YEN KEOW RICHARD

TAN YEN KEOW RICHARD

Summary

Knowledgeable [Desired Position] with background in executive leadership. Guided strategic initiatives that enhanced operational efficiency and fostered organizational growth. Demonstrated expertise in leadership and strategic planning.

Overview

2024
2024
years of professional experience
1
1
Certification

Work History

Process Engineering

  • Yield & Quality Improvements.

Vice President of Global Operations

MKS Instruments, Inc
07.2018 - 01.2024
  • Reports to SVP/Head of Global Operations
  • Dotted-line to Division General Mgr (SVP)
  • Member of the Executive Leadership Team of ESI Inc
  • MKS acquired ESI Inc in

Vice President of Global Operations

ESI Inc
07.2013 - 07.2018

GM & Local Director of ESI

- 01.2017
  • Reporting to CEO, ESI Inc
  • Member of the Executive Leadership Team of ESI Inc
  • Monthly/Qtrly Business Reviews (MBR/QBR) to BOD
  • Responsible for Order & Revenue Fulfilment, Mfg Cost & Overheads, Operating-Income
  • Owns all Global Operations & Mfg in ESI Inc
  • (all Operations/Mfg KPIs & Goals)
  • Responsible for 7 ESI Mfg sites worldwide and major CMs (Localization)
  • ESI Mfg Sites: PDX, K-Falls, Chelmsford, Freemont, Beijing, Wuhan, S’pore
  • Major CMs: Fabrinet, ACM, CEI, Comtrotek, Computrol, Bizlink, Winchester
  • Established SIOP Process in Inc
  • Owns Planning & Supply/Demand management
  • Inventory Mgt & Control Strategy
  • Supply Chain Mgt, Suppliers & Contract-Manufacturers (CMs) development, localization to Asia, SCM Cost Reductions and all Supply Chain KPIs
  • Global Logistics/Freight/Ware-housing mgt
  • Plant/Facilities/ESH management across all Mfg & WH sites
  • Optimize Plant-Utilization
  • Established Quality Engrg Function in ESI and all Quality Certifications (eg ISO)
  • Instituted LEAN/CIP Culture & Program, Cost-Savings/Cost-Avoidance measurements & reporting
  • Major Achievements
  • Consolidated 7 Mfg sites into 2 World Class Operations/Mfg sites
  • Improved RPSF (Rev/sq-ft) from $5.8k to $12.9k (2014, )
  • Folded Beijing Laser Plant into Spore site in 6mths, achieved >30% overall value-add
  • Established ESI as a successful Systems Integration Manufacturer with dynamic burst capacity/capabilities, proven by 2017/2018 surge-ramp
  • Achieved record year from $170M (2017) doubling to $380M (2018)
  • Successfully ramped/surged in just 4 months delivering >60% of the $380M
  • CEO/BOD was in Spore to witness phenomena ramp in Spore
  • Transformed SPO from a <$200M to a easily $500M-capable COE Site in 4 years
  • Drove Asia-Localization of Supply Chains, away from USA/Europe centric source
  • Successfully localized >40% of BOM from High Cost Countries to Asia
  • 72% of critical BOM parts/modules with Dual/Double source
  • (BCP)
  • Led BOM-restructuring, achieved 15% cycle-time reduction & 18% FLEX/MLCC savings
  • Achieved ISO 9001 in SPO in just 4mths (2014) as the only ISO-certified site in ESI
  • Achieved >$4M savings for FLEX/MLCC mfg cost (2015, ) thru LEAN/CIP
  • Laser Systems Mfg cycle-time improved by average 8%~10% YOY from 2021-23

Senior Director

MEMC/Sun, Singapore Pte Ltd
01.2010 - 07.2013
  • Reporting to SVP of Solar Energy Division, GM of Wafers & Cells
  • Inhouse & Subcon/CM operations for solar globally
  • Manage Joint-Venture Plant (JV Plant GM reports to me)
  • Manage Subcons & Contract Manufacturers
  • Directs Solar Operations:
  • Operations Management, Supply Chain Mgt, Suppliers development, Procurement (Wafers, Cells, Poly) Inventory Control, Cost/Quality, Logistic, Products Lifecycle Mgt
  • Manage AP/AR and Cash Flow for Wafers, Cell & Modules
  • Manage purchase, trading & sales of Polysilicon, Wafers and Cells
  • Wafers & Cells margin accountability
  • Supply Chain KPIs: Delivery, Cost, Cycle time, Capacity, Yield/Quality, Inventory Level, Logistics
  • Develop, implement, and enhance Solar Wafer Manufacturing value-chain & flow
  • Manage Inventory worldwide
  • Drive Process & Productivity improvement and optimization for all sites
  • Drive solar manufacturing/cost/technology roadmaps & strategy
  • Develop & qualify new solar subcons
  • (capacity/capability readiness)
  • Ensure MEMC policies & statutory regulations compliance at all sites/countries
  • Major Achievements
  • Contributed to Solar Wafer Revenue of $1.940Bil since joining
  • US$720mil (2010); US$680mil (2011); US$540mil (2012);
  • Managed manufacturing base from 10 sites (2009) to a peak of 18 sites (2011-Q2)
  • Negotiated to convert MEMC-Renesola Tolling into Purchase Agreement, saved $6.1Mil in 2012
  • Improved Annual Delivery: 133Mpcs (2009) to 258Mpcs (2011)
  • Improved Quarterly Wafer Delivery from 43.2 mil-pcs in 2010 to record of 88.2 mil-pcs in 2011
  • Consistently improved & maintained +ve Cashflow for 12 consecutive Qtrs (2010

Chief Operating Officer

Scientific Industries (ESI) Inc
- 01.2012
  • Director for MKS/ESI-S’pore entity
  • (Corp Governance, Annual-filings, Tax compliance)
  • MBR/QBR reporting to MKS Corp Executive Team
  • MKS LEAN Council member
  • Main S’pore Govt/EDB relationship holder (S’pore Govt Ministries, EDB senior leadership)
  • Member of both MKS M&A Team (Merger & Acqn) and Integration Team (Post M&A)
  • Owns Systems & Laser Manufacturing, Order & Revenue Fulfilment
  • Owns all Operations KPIs for Equipment Solutions operations globally
  • Profit & Cash accountability (Savings Program – reports up to CFO/CEO)
  • Global Operations/Mfg Footprint, Business Continuity Planning (BCP), Facilities Setup
  • Annual Operations CapEx & Expense Budget Planning & Responsibility
  • Partner with Business Unit (BU) for SIOP Management
  • Manage/Optimize Inventory, 3PL Mgt, Global Freight & Shipment
  • Manage/Drive Supply Chain & CM (Contract Manufacturers) Performance & Strategy
  • Customer Satisfaction KPIs (OTD, Out-of-Box & Installation Quality)
  • Cascade Best Practices (LEAN, ESH, Security) across all Mfg Sites
  • Ensure Export Control & Global Trade Compliance (Lasers & Systems)
  • Direct/Indirect Cost, Inventory Control, Products Lifecycle Management, Dfx/DfM
  • Major Achievements
  • Member of ESI M&A Team which managed the due diligence that resulted in MKS Instruments acquiring ESI Inc
  • Responsible for Operations/SCM’s integration into MKS
  • OTD (Promise, Request) consistently >99% over 4 years
  • Successful Acquisition & Integration of Atotech ($2.4B Rev) with zero issues roll-over
  • Consistently exceeded Corporate Profit & Cash Targets for 4 years thru matured LEAN/CIPs
  • 2023 Savings of $1.1M (target $900k)
  • 2022 Savings of >$1.3M (target $0.9M)
  • Improved global Inventory from ~$148M (2017) to $65M (2023)
  • Successfully localized >55% of BOM from High-Cost Countries to Asia
  • Warehousing & Inventory Accuracy achieved 99.99% accuracy for 3 years consecutively
  • Extended Economic Dev
  • Board’s DEI-status (low 5% tax) for 5 more years, from 2027 to 2031
  • ESI (S) awarded Pioneer-status (0% tax) for 10years, Extended 5% DEI from ‘22 to ‘31
  • 2022-‘23: >$2.5M Covid subsidy & >$600k Training Grants from EDB
  • S’pore plant voted as Role-Model Site for LEAN, Innovation, ESH and Security in 2020-23
  • S’pore Operations declared as COE (Center of Excellence) for both Lasers & Systems Mfg
  • Established global super-hub, reduced 7 hubs into 1, saving >$1M annually
  • Successfully started Insight fs Laser in SPO during COVID lock-down (zero support)
  • Improved Laser Systems Mfg cycle-time by average 8%~10% YOY from 2021-23
  • Taskforce member that selected new Mega 600ksqft site in Asia
  • Strategy approved by BOD
  • Division endorsed setup of Technical-Ops in Spore (from Milpitas, CA) starting 2023
  • Electro, )
  • Improved 2012 Margin from Q1: -15.2% to Q4: +16.6%
  • Wafer Yield Improvement (>US$30Mil savings/revenue): 37.6wfrs/kg (2010) to 45.0wfrs/kg (2012)
  • Improved $/wafer Mfg Cost (-70.5% over 40mths): $3.02 (Q1’10) to $0.89 (Q1’13)
  • Drove JV plant Conversion Cost from $0.80 (Q3’11) to $0.54 (Q3’12) to $0.51 (Q1’13)
  • Salvaged >800mtons of scrap materials @$50/kg (>US$40 million savings)
  • Improved Wafer Efficiency from 15.91% to 16.85%, generated US$15.3Mil revenue
  • Improved OQL from 1200ppm (Q4’09) to 510ppm (Q4’12)
  • Improved Cycle time from 11.2 days (2010-Q1) to 7.6 days (2012-Q2)
  • Improved slicing yield from 78% (2011) to 86% (2012) while achieving 0.4AQL
  • Led JV plant to achieve competitive Specs capability 5 months ahead of Market
  • Sustained average Cpk above 1.8 despite volume increase and improved Specs
  • Reduced Overhead-Cost per Output by -33.4% for period Q1-2010 to Q4-2011.

Director

Infineon Technologies Asia Pacific Pte Ltd
08.2009 - 12.2009
  • Production, Planning, Logistics (PL), Held double office of Production Logistics Head and Business Divisions Interface
  • Headed Production Logistics (PL) department and Shipping department
  • Reported to Senior Vice President, GM AP & Logics Cluster
  • Responsible for delivery from Logic/CMOS sites (2 inhouse, 7 major subcons)
  • Driver for Excellence Programs (DLCS):
  • Delivery, Logistic, Cost, Cycle-time, Supply-chain
  • Driver for WIP short & Inventory Level Control between SIN & MAL plants
  • Interface to all Business Divisions (BD) for delivery & supply chain topics
  • Taskforce leader for all major BD-focused deliveries
  • Establish and drive LEAN activities, Taskforce leader for delivery crisis management
  • Driver to eliminate Logistics Missing Lots
  • Manage APAC shipping/logistics activities (inbound, outbound, transit/transfers for all routes)
  • Major Achievements
  • Achieved: >95% Orders Fulfillment,
  • Successfully fulfilled 96.5% Super-Fast Track orders within Q4 (Target: >95%)
  • Record 27.2% savings in Shipping/Freight Cost despite >30% increase in volume
  • Redesigned Logistic/Shipping flow
  • Achieved 9% overtime cost reduction in Shipping Dept
  • Fulfilled 98.6% Change Order Requests (COR) from Business Divisions
  • Achieved 96.5% vs Plan 96.3% for WIPShort to Test performance
  • Reduced 2009-Q4 Spare Parts inventory cost by 12% against budget.

Director

01.2009 - 12.2009
  • Represent Division/Segment Head to interface with Business Divisions (BD)
  • Translate business expectations to Segment Head & Segment Functions
  • Represent Segment Head on all business critical topics & crisis management
  • Drive competitiveness & excellence thru Internal/External Benchmarking
  • Assist Segment Head to review & drive Cost/Quality Programs and key projects
  • Assist Segment Head to drive subcons’ performance & major subcon projects
  • Establish Key Revenue Focus Products drive to optimize revenue & profitability
  • Optimize Package Cost Roadmaps & Materials (Cost) Roadmaps
  • Key involvement for all Technology, Platform and Product Package Roadmaps
  • Support Segment on all Change Managements for Assembly & Test processes
  • Major Achievements
  • Pioneered and setup BDI function & structure
  • Reduced BDs escalations/complaints by 72%
  • Successfully improved Revenue by S$11.8 Mils thru Yield Improvement
  • Optimized Supply Chain practices and recovered value-adds of S$5.2 Millions
  • Reviewed Wireless Products Cost Roadmap to enable a 27% cost down for FY2009
  • Managed 3 business critical builds linked to potential revenue of S$82 Millions
  • Initiated Cost Reduction Programs that amount to S$6.2 Millions savings in FY2009
  • Finalized “Ultra Low Cost” product costing with -47% cost reductions over 18 months

Director

10.2007 - 12.2008
  • Manufacturing & Process Engineering for the entire Laminate Business Segment, consisting 100% In-house and all Sub-contractors
  • Board Member of Equipment-Materials-Process Board, Risk Assessment Board
  • Consultant to Advanced Process Control Board & Member of Reverse Engrg Team
  • Integrate Mfg-Engrg, Process-Engrg, Subcon-Mgt into new Mfg-Engrg (ME) Department
  • Responsible for all New Product Introductions (NPIs) & ramp-ups
  • Develop manufacturing capabilities for high volume production
  • Lead Change Management (PCN) and harmonization with Business Units
  • Develop and qualify new suppliers, new equipment & process technologies
  • Update Procurement, Process, Control & Operating Specifications
  • Direct Innovations & Productivity Programs to all areas (Cost, Efficiency & Lean Mfg)
  • Drive Zero Defect, Process/Manpower/Yield optimization & OEE improvement
  • Major Achievements
  • Spearheaded Top 15 Innovations & Productivity Projects, generated S$15 Millions in cost reductions
  • (Accountable to Division Head)
  • Managed and ramp-up 9 new key products with revenue >S$220 Millions for FY2008
  • Generated S$420,000 savings through benchmarking with subcons
  • Reduced S$900,000 in cost by Process Simplifications & Eliminations at 3 processes
  • Developed 5 new suppliers (4x materials and 1x equipment), resulting in S$420,000
  • Reformed ME/PE/NPI/SM into new ME-Dept with same headcounts, savings ~S$810k
  • Improved Yield from 99.02% to 99.5%
  • Improved Quality Spills to Customer from 0.75 to 0.54 (cpB) cases per Billion pieces
  • Improved Line OEE from 98.32% to 98.56% saving >S$6,000,000 in capital invest
  • Achieved -24.5% Expense savings in 2008
  • Reduced subcon problem WIP on-hold by 50% (800kpcs to 300kpcs in 4months)
  • Reformed Mold operations for SIN & MAL, saving S$550,000 (OEE increased 8%)
  • Successfully setup Malacca Manufacturing Engrg Team in 9mths (10 engineers)
  • Director, Production (Wafer Test, Assembly & Test) July‘06 to Oct’

Coach/Taskforce

- 01.2007
  • Leader for SMARTI-SLIC project: restored yield from 72% to 96%., Led Production workforce of 1100 staffs (managers ~ operators) within a budget of S$80Mil
  • Drove Supply Chain excellence for Wafer-Test, Assembly, Test & MSP
  • Pushed Breakthroughs in Delivery Output, Production Cost, Cycle-time, Delivery Accuracy, and Headcount Efficiency Optimization
  • TPM Steering Committee member, driven TPM programs to all areas
  • Assisted Cluster GM to setup & drive Delivery/Cost Excellence Program across all Sites
  • Implemented Zero-Defect Programs to eliminate operative failures
  • Eliminate Under-Utilization for all equipment/mfg cells
  • Optimize Mfg/Subcon WIP
  • Re-structured Direct headcount strategy to ensure lean manufacturing in all areas
  • Major Achievements
  • Achieved record delivery output of 22Mil pcs/wk (+22% from 18Mil pcs/wk in 2007) while reducing headcount by ~12% and cost below budget by ~15% (S$12Millions)
  • Appointed as Overall Cost Excellence Program driver for Singapore, Malacca & Batam plant
  • Spearheaded Top 20 Cost Efficiency Projects with S$44 Millions cost reductions
  • Established Delivery Excellence Program across 3 sites
  • Supported ramp-up of 15 new key products with revenue >S$320 Millions (FY2007)
  • Redeployed 40 direct staffs through Lean Mfg Restructuring saving S$1.2Millions
  • Revamped production materials sourcing strategy and saved S$1.8 Millions
  • Improved SIN Assembly supply chain cycle-time from 31.5days to 14.2days
  • Improved SIN Test supply chain cycle-time of from 12.4days to 6.4days
  • Improved Delivery Accuracy by 8% and Supply Chain cycle-time from 14.5days to 8.2days
  • Significantly reduced Ops failures from 24 cases (2005) to only 10 cases in (2007) through ZDP
  • Upgraded 82% of operative staffs to achieve Skill Level-4 (Target is 75%)

Senior Manager

Equipment Engineering
09.2003 - 07.2006
  • Drive Breakthroughs in Maintenance Cost, OEE, UPH & Equipment Strategy
  • Assisted GM to setup Cost/Quality Excellence Program
  • Appointed as TPM Mgt Committee Member to develop & implement TPM programs
  • Implemented Lean Manuifacturing, CoO and TPM Step-4 into Assembly Cells/Lines
  • Established pilot & revolutionary APC (Advanced Process Control) capability
  • Major Achievements
  • Achieved savings of 28% in maintenance cost (Budget S$23.2 Millions over 3 years)
  • Implemented OEE & TPM programs, improved OEE by 26%: 2003 (60%) to 2006 (86%)
  • Achieved record OEE of >95% for 3 equipment types (Dicing, Wire Bond, Singulation)
  • Introduced new Tape-assisted Molding & reduced Mold Downtime by -15%
  • Cascaded TPM Step-4 to 70% of TPM Cells by 2006
  • (only 12% is Step-4 in 2003)
  • Setup CoO training methodology & trained 80% of engineers in CoO
  • Established APC for Mold, Wire Bond & Trim/Punch, prevented 18 customer spills.

Senior Manager

10.2000 - 09.2003
  • Accountable for setting-up & reviewing IC manufacturing strategy and efficiency
  • Established new suppliers, new equipment & process technologies
  • Devised & implement Materials Efficiency and Productivity Programs
  • Drive Lean Manufacturing & best cost efficiency
  • Setup Equipment Benchmarking systematics
  • Managed new product ramp-ups for in-house & subcons
  • Within dept
  • Budget of S$8.6 Mils
  • Major Achievements
  • Led Materials Efficiency & Productivity teams
  • Achieved S$26 Millions cost savings
  • Appointed as Leader of GREEN PROJECT
  • Established the 1st Green Conversion Roadmap and converted 45% of products to Green ~1year ahead of target
  • Improved WB throughput by 16% resulted in S$2 Millions investment savings
  • Setup Equipment & Materials Board that included members from 5 sites
  • Brought in 3 new equipment types: Average MTBF improved from 80hrs to 400hrs.

Manager, Transfer Team Leader

Equipment Engineering
05.1999 - 10.2000
  • Led equipment engineering & maintenance to reduce maintenance cost
  • Drive Overall Equipment Efficiency (OEE) improvement
  • Buyoff and installed new machines
  • Appointed as TPM coach to drive and implement TPM
  • Developed and setup new PM System, and PM performance indicators
  • Technology, , Management Self Assessment Team Member
  • Major Achievements
  • First ever (breakthrough) to improve unscheduled downtime to
  • Revived the failed ABOS AutoLine project, generated S$800,000 savings
  • Achieved record savings of 36% in Maintenance Cost for FY1998/99 & 100% PM-Fulfillment
  • Re-structuring of PM Team, reduced 8 PM technicians & PM Overtime hours by -5%
  • Successfully reduced PM-cycletime from 3 days to 1.7 days
  • Accomplished 42% downtime improvement (17% in 1998/99 to 9.8% in 1999/2000

Senior Engineer

Siemens Microelectronics (AP) Pte Ltd
06.1995 - 04.1999

Lead Mold Engineer

- 01.1997
  • Appointed by GM as EOL (QFP) “2DPM Program” Leader
  • Develop EOL Maintenance programs to enable quality and yield improvements
  • Buyoff & qualified new equipment, new materials/process
  • Leader of TQM/TPM End Line Team
  • Member of MMO & OEE Teams
  • Major Achievements
  • Improved the Yield at Molding Process from 89% to ~99.97% from 1995 to
  • Introduced new Mutli-Gang pot molding concept, resolved Void & Warpage issue
  • Implemented Micro Carbide mold plungers that saved $180,000 in maintenance cost
  • Setup, commissioned and buyoff 15 Auto-Molding systems within 14 months.page or this document
  • Simp

Education

Graduate Diploma - Business Administration

Singapore Institute of Management
01.1998

B.Eng - Mechanical & Production Engineering

Nanyang Technological University
01.1995

Skills

  • Revenue, Cash & Margin
  • Strategic Planning
  • Operations Management
  • Government Tax Incentives
  • Mergers & Acquisition (M&A)
  • LEAN
  • New Plant/Facilities Setup
  • Plant Management
  • Process re-engineering
  • OEE & TPM; Cost of Ownership (CoO)
  • Supply Chain Excellence
  • Inventory Management
  • Cost / Delivery / Cycle-time Excellence
  • Manufacturing/Engineering Mgt
  • New Product Transfer (NPI) & Technology Transfers
  • Quality & Yield Mgt
  • 3PL & Subcontractor Management
  • Advanced process engineering

Personal Information

Title: Vice President of Global Operations & Successful Leader

Certification

  • Executive Leadership Team (VP, Global Operations) ESI Inc.
  • Company Director MKS M&A (Merger & Acquisition) & Integration Core Team

Philanthropic

  • Executive Vice President, Singapore Buddhist Merit Society
  • Vice President, Singapore Chinese Cultural Promotion Society

Timeline

Vice President of Global Operations

MKS Instruments, Inc
07.2018 - 01.2024

Vice President of Global Operations

ESI Inc
07.2013 - 07.2018

Senior Director

MEMC/Sun, Singapore Pte Ltd
01.2010 - 07.2013

Director

Infineon Technologies Asia Pacific Pte Ltd
08.2009 - 12.2009

Director

01.2009 - 12.2009

Director

10.2007 - 12.2008

Senior Manager

Equipment Engineering
09.2003 - 07.2006

Senior Manager

10.2000 - 09.2003

Manager, Transfer Team Leader

Equipment Engineering
05.1999 - 10.2000

Senior Engineer

Siemens Microelectronics (AP) Pte Ltd
06.1995 - 04.1999

B.Eng - Mechanical & Production Engineering

Nanyang Technological University

Process Engineering

GM & Local Director of ESI

- 01.2017

Chief Operating Officer

Scientific Industries (ESI) Inc
- 01.2012

Coach/Taskforce

- 01.2007

Lead Mold Engineer

- 01.1997

Graduate Diploma - Business Administration

Singapore Institute of Management

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