TANG JIAN
Singapore
Summary
Professional in engineering with proven ability to optimize processes and improve production efficiency. Extensive experience in developing and implementing engineering solutions that enhance operational performance. Known for collaborative team efforts and results-driven approach, showcasing skills in process design and quality control.
Overview
22
22
years of professional experience
Work History
Staff Process Engineer
Heptagon Photonics Pte. Ltd.
Singapore, Singapore
10.2024 - Current
- Working as a Staff Process Engineer, responsible of mechanical dicing and laser cutting process. Take care of line support and sustain, lot disposition and quality control. Also take care of yield loss report and process document maintenance like PCP, FMEA, SOP and WI.
- In 2024-2025:
- Develop mechanical dicing process of new product Outreach, it would be launched mass production in 2026 Q2.
- Product and technology transfer existing product of Automotive from Singapore to Shaoguan for dicing process.
- In 2025-2026:
- Develop laser cutting process of new product Opal, it would be launched mass production in 2026 Q4.
- Product and technology transfer existing product from Dongguan to Singapore.
Staff Process Engineer
ams-OSRAM Asia Pacific Pte. Ltd.
Singapore, Singapore
02.2015 - 09.2024
- Working as a Staff Process Engineer, responsible of back-end grinding, polishing and dicing process. Take care of line support and sustain, lot disposition and quality control. Also take care of yield loss report and process document maintenance like PCP, FMEA, SOP and WI.
- In 2017, my department (Process Engineering) changed to NPD (New Product Develop) department for new technology and new product development. Develop new product for external customer and internal customer, take care dicing process for new product development to meet customer requirement for different material (glass, epoxy, substrate and foil) and different thickness (0.1mm to 15mm). Successfully develop products like encoder sensor, ambient sensor, and optical sensor for external and internal customer.
Pre-Assembly Process Engineer
STATS ChipPAC Pte. Ltd.
Singapore, Singapore
11.2012 - 02.2015
- Working as a Pre-Assembly Process Engineer, responsible of Pre-Assembly process, which includes wafer taping, back-grinding, wafer mounting, wafer dicing and laser groove process. Take care product yield, quality control, recipe creation, fine tuning and buy off. As a process engineer, I also take care new device/product setup and buy off, line support and sustain, daily report and any yield loss report like 8D, update production document like FMEA, SOP.
Back-Grind Technician
Infineon Technologies Asia Pacific Pte Ltd
Singapore
03.2004 - 11.2012
- Working as a Back-Grind Technician in Front of Line Pre-Assembly area, responsible of Advanced Pre-Assembly production, which includes lamination/mounting, back side grinding, wafer dicing, wafer mounting process, include machine operation and maintenance, production material flow arrangement and management, quality control and inspection, attended machine operation and maintenance training such as Disco G8560, G8660 & D6360, Adwill 2500, 3500 & 3700, attended industrial related training such as Good Mfg Practice, 8D, Coaching skill For Ojt, SPC level 1, Quality Improvement Course, etc.
- From May 2008, transfer to Engineering Sample Department, as a member of Assembly Team in ES, build sample order as requester's requirement. Work with LAPD group (R&D), evaluate new device and new technology before it is released to Production Dpt. Sample build orders for customer, collect parameters and process data for new package.
Education
Bachelor of Engineering - Electronic Engineering with Honours
University of South Australia
09.2010
Diploma in Electronics, Computer & Communication Engineering - Majoring in Telecommunication Engineering
Singapore Polytechnic
07.2003
Graduation Certificate for Senior Middle school -
China Xinjiang Urumqi No.1 Middle School
07.1999
Skills
- Disco Dicer 6XX and 6XXX serials
- Disco Grinder 8XXX serials
- Lintec Laminator 3500 serials, Mounter and Peeler 2500 and 2700 serials
- Koses & QY Laser cutting machine
- Using computer programs like as Microsoft word, Microsoft Excel and PowerPoint
- Using process software like JMP, SPC for process data analysis
- Process development
- Production planning
- Process validation
- Continuous improvement
- Root-cause analysis
- Design of experiments
Accomplishments
- Led project on Virtual Reality Tour for Singapore Polytechnic and selected for INNOVEX (School of Electronics and Electrical Engineering Project Exhibition 2003)
- Led Pre-Assembly Team and won the Gold Prize in Infineon Technologies Asia Pacific Pte Ltd in the 12th TPM (total preventive maintenance) Convention 2008.
- Led Pre-Assembly Team and won the Silver Prize in National IQC Convention 2008.
- Participated in Pre-Assembly Team Cost Saving project and won Gold Prize in Stats ChipPAC 2014.
- Developed and Launched Mass Production for SIHL product in Heptagon 2016 as dicing process engineer.
- Developed and Launched Mass Production for Ichfish product in AMS 2018 as dicing process engineer.
- Developed and Launched Mass Production for Firefish product in AMS 2018 as dicing process engineer.
- Developed and Launched Mass Production for Firesh 2 product in AMS 2019 as dicing process engineer.
- Developed and Launched Mass Production for Icefish 3 product in AMS 2020 as dicing process engineer.
- Developed internal product for Dartfish, Mona, Simme, Tetra and Marumo in NPD dept in AMS-Osram from 2021-2024 as dicing process engineer.
- Developed and Launched Mass Production for Outreach product in Heptagon Photonics Pte. Ltd. in 2024-2025 as dicing process engineer.
- Developed product for Opal in Heptagon Photonics Pte. Ltd. from 2025-2026 as laser cutting process engineer.
Language
Fluent in English and Mandarin (spoken and written)
Timeline
Staff Process Engineer
Heptagon Photonics Pte. Ltd.
10.2024 - Current
Staff Process Engineer
ams-OSRAM Asia Pacific Pte. Ltd.
02.2015 - 09.2024
Pre-Assembly Process Engineer
STATS ChipPAC Pte. Ltd.
11.2012 - 02.2015
Back-Grind Technician
Infineon Technologies Asia Pacific Pte Ltd
03.2004 - 11.2012
Bachelor of Engineering - Electronic Engineering with Honours
University of South Australia
Diploma in Electronics, Computer & Communication Engineering - Majoring in Telecommunication Engineering
Singapore Polytechnic
Graduation Certificate for Senior Middle school -
China Xinjiang Urumqi No.1 Middle School
Capabilities
Two month notice service is required after the submission of resignation letter.
References
- Wong Hong, Kee, Project supervisor, mikewhk@sp.edu.sg, +65—68792145, School of Electrical and Electronic Engineering Singapore Polytechnic, 500 Dover Road, Singapore, 139651, Office: T12A504
- Lau, Personal Tutor, lausf@sp.edu.sg, +65—67723474, School of Electrical and Electronic Engineering Singapore Polytechnic, 500 Dover Road, Singapore, 139651, Office: T12A503
- Foo Siak, Meng, Line Engineer of FOL A shift, +65—68400173, Infineon Technologies Asia Pacific Pte Ltd, 168 Kallang way, Singapore, 349253
- Lee Khok, Seng, Team Leader (Engineer) of Engineering Sample Assembly Team, +65—68404530, Infineon Technologies Asia Pacific Pte Ltd, 168 Kallang way, Singapore, 349253
- Eric, Lee, Section Manager of Pre Assembly, +65—68241300, STATS ChipPAC Pte. Ltd., 5 Yishun Street 23, Singapore, 768442
- Law Choon, Hein, NPD Back-end Manager, +65—62402275, ams-OSRAM Asia Pacific Pte. Ltd., 7000 Ang Mo Kio Ave 5, #05-00, Singapore, 569877
- Steven, Zin, Back-end Process Manager, +65—85005202, Heptagon Photonics Pte. Ltd. – A Focuslight Company, 7000 Ang Mo Kio Avenue 5, #06-02-03, Singapore, 569877
- Sun, Zhangxin, Staff Process Engineer, +65—92386519, Heptagon Photonics Pte. Ltd. – A Focuslight Company, 7000 Ang Mo Kio Avenue 5, #06-02-03, Singapore, 569877
Interests
Sports, computer games, traveling.