Rubini Krishnan
Packing And ESD R&D Engineer
Pasir Gudang
Summary
Experienced engineer with focus on driving innovation in research and development. Recognized for delivering impactful solutions and fostering collaborative environments to achieve project objectives. Reliable team player with adaptability to evolving project needs and strong technical acumen in R&D processes.
Overview
7
7
years of professional experience
2
2
Languages
Work History
Packaging and ESD R&D Engineer
STMicroelectronics Private
03.2023 - Current
- Act as a central R&D function owner for packaging and ESD‑related material and process changes across semiconductor products.
- Lead evaluation, qualification, and implementation of new packaging materials, including change management and impact analysis on reliability and manufacturability
- Drive sustainable packaging development initiatives, aligning with corporate ESG goals, cost, quality, and regulatory requirements
- Develop ESD control program on 5 control items across back end manufacturing
- Develop and complete 2 ESD closed loop monitoring in tester equipment
- Develop and deploy centralized packaging and ESD solutions to standardize processes across multiple sites and product families
- Define and optimize packaging configurations to improve product protection, handling efficiency, and ESD robustness throughout the supply chain
- Support 3 automation process development for packaging and handling operations to improve productivity, consistency, and yield
- Collaborate closely with suppliers to resolve material, process, and ESD performance issues, including root cause analysis and corrective actions
- Conduct risk assessments, trials, and validation activities to ensure compliance with semiconductor quality, reliability, and ESD standards
- Partner with manufacturing, quality, reliability, and NPI teams to support product transitions and continuous improvement initiatives
- Maintain and enforce technical standards and specifications for packaging materials, processes, and ESD control methodologies
Material And Development Engineer
Nexperia Sdn Bhd
Seremban
12.2021 - Current
- Qualified and evaluated raw material, design, and supplier changes ensuring quality and process compliance
- Assessed risk and process impact through FAI, material testing, and reliability validation per QDS requirements
- Drove material engineering KPIs focused on cost reduction, supply security, and product quality/reliability
- Planned and coordinated reliability stress testing across manufacturing sites
- Collaborated with global sourcing and material characterization teams to identify new materials, suppliers, and cost‑saving opportunities
- Performed data validation and statistical analysis to ensure process capability and specification compliance
- Communicated effectively with engineering, quality, manufacturing, and project stakeholders on material development and validation status
Process Engineer
Hydro metal Sdn Bhd
Johor bahru
08.2019 - 11.2021
- Managed IETS operations ensuring treated effluent compliance with DOE Standard B and regulatory requirements
- Optimized wastewater treatment processes, including chemical dosing, coagulation, and sedimentation, with effective troubleshooting
- Supported process validation, equipment maintenance, calibration, and laboratory testing (ICP‑OES) to enhance waste analysis capability
- Implemented and audited ISO 14001 Environmental Management System, managed scheduled waste, and supported environmental audits and compliance
- Designed and executed experiments to identify process improvements, leading to reduced costs and increased efficiency.
- Conducted root cause analysis to identify, prioritize and eliminate process losses.
Education
MBA -
Master in Business Management And Administration
Malaysia 04.2001 -
Bachelor - Chemical Engineer
Universiti Putra Malaysia
Selangor11-2019
Skills
- Effective communication
- Efficiency improvement
- Analytical skills
- Statistical Process Control
- Analytical assessment
- Manufacturing processes
- Effective problem-solving strategies
Achievements
- Qualify 2nd source of normal PPF for SOT833 with cost saving of 8K annually , ( 2022)
- Bond line thickness improvement by conversion of non conductive epoxy to Die Attach Film , ( 2022)
- Qualify new raw material Dowa in the market for SOT023 non-automated devices with the return of 60K annually as saving ,(2022)
- Reselling disposed epoxy which returns 10K monthly
- Conversion of dual to matrix leadframe for RF devices to increase the yield output , ( 2022)
- Wastewater alternate pipeline development for heat loss of exothermic process , ( 2019)
- Plant expansion Project collaboration with environmental department which increase revenue by 200K , (2021)
- Yearly cost savings earned 130K since 2023-2025 on materials for packaging across all BEMT
- Developed indirect material management solution for materials at the process sites
- Develop and establish a qualification plan on black interleaves for wafer packing solution
- Develop a test on humidity indicator card (HIC) workability which enhanced the qualification procedure for HIC.
Timeline
Packaging and ESD R&D Engineer
STMicroelectronics Private
03.2023 - Current
Material And Development Engineer
Nexperia Sdn Bhd
12.2021 - Current
Process Engineer
Hydro metal Sdn Bhd
08.2019 - 11.2021
MBA -
Master in Business Management And Administration
04.2001 -
Bachelor - Chemical Engineer
Universiti Putra Malaysia