Ronald Allan Buensalido Rodil

Experienced Maintenance Engineer with a strong background in semiconductor manufacturing, specializing in machine troubleshooting, calibration, and process optimization. Proven ability to collaborate effectively with cross-functional teams to identify and implement solutions that enhance equipment performance and production efficiency. Support continuous improvement initiatives and cost reduction drive projects.

I am a hardworking person with 25 years of experience in a semiconductor company in both assembly and wafer fabrications in Singapore and Philippines. Performing diverse duties and analyzing to solve the issue.

· 14 yrs of experience as an Assistant Maintenance Engineer – Singapore, (Wafer Fabrication) (Photolithography) – Machine handled - Canon i2, i3, i4, i5, i5+, DUV and Scanner.

· 11 yrs of experience as a NPI (New Product Introduction) – Philippines, (Assembly),

Expert in both Wire bond (Gold and Aluminum wire) and Die attached (Eutectic) -

Machine handled - Westbond 2400, KNS, Delvotec, MRSI, Hughes, Sealing, Tape and Reel, and Smart scope.

• First Aid and CPR (company CERT with SCDF certificate) - Singapore
• Fire protection systems (company CERT with SCDF certificate) - Singapore
• Automotive maintenance (basic on both car and motorcycle)

• B572 Hougang Street 51, Singapore, 530572

    Mobile: +65 94880827 

• Blk23 Lot32 San Isidro Heights Subd P1, San Isidro, Cabuyao, 4025, Mobile: +63 09287391476

• Marilou A. Bigcas, Manager, New Product Introduction group, NXP Semiconductors Philippines
• Levi G. Mateo, Senior Maintenance Engineer, ST Microelectronics Pte Ltd, Singapore

• Project leader on high and low frequency devices for Base Station applications for customer NSN, Huawei and ZTE and other small customers.
• Conduct product orientation and special instructions for new product and package releases for Engineers, Technicians, Supervisors and Operators.
• Participate on conference call in Group and One on One communication for Nijmegen counterpart for new product introduction to ensure product releases on time.
• Support other product type for microwave applications and high-power base stations products.
• Author and Co-Author of Technical papers presented in ASEMEP for New Product Introduction projects and product releases.

• Create and Conduct Assembly DOE for new package device and new process flow with documentation for ACP (Air cavity plastic package) using ring-frame attached different procedure on sealing process using new loading tool on ITS machine.
• Create and Conduct Assembly DOE for new package device and new process flow with documentation. For Sumitomo pre-glued cap using different procedure on sealing process.
• Create different parameter for wire-bond loop shape and loop form to eliminate wire snapping for new device and package using GOLD wire and ALUMINUM wire.