Technical Skills: 2D and 5D X-ray applications, High proficiency in component replacement (SMT, PTH) and PCB circuit repairing, Knowledge of IPC 610 standards for electronic assemblies, Creation and review of work instructions and operating procedures, Jig and fixture designing, modification using milling, drilling, and turning machines, Potting and coating processes for PCBA, Research and development, failure analysis, and process improvement, Implementation of cost-saving projects exceeding $50,000/year
Projects
Cost Savings, Achieved 20% reduction in laminate paper usage, saving $50,000/year. Contamination Reduction, Reduced laminate defect contamination by 50%. Cycle Time Improvement, Enhanced machine cycle times for better efficiency.
Timeline
Engineering Department
Linxens Technology
09.2022 - Current
Process Engineering Department
Linxens Technology
03.2011 - 01.2019
Process Engineering Department
Benchmark Electronics
05.2007
Bachelor’s Degree in Industrial Technology of Production -