MOHD FAID BIN MOHAD HISA

PLASMA DICING PROCESS

Trusted by superior to involve in new process technology (dry etch) of the company

• Enhanced production efficiency by optimizing assembly line processes and equipment.
• Do health screening of machine before and after process to collect data (e.g. chamber condition, leak test, ESC table condition).
• Provided technical support during equipment preventive maintenance, ensuring timely completion and minimal disruption to production schedules.

Working as AEII at Flipchip Engineering department. My responsible are:

• Die attach, Flipchip die and shield attach machine conversion and buyoff
• Increased throughput by streamlining workflow and eliminating bottlenecks in the production process.
• Collaborate with Process Engineer (PE) when have issue with quality to improve machine performances and parameter
• Undergo preventive maintenance and troubleshooting to decrease machine downtime that can affect output and productivity
• Support Equipment Engineer (EE) to do major service of machine

• Works with team of 3 engineers responding for the SMT line issues
• Continuously improve product cycle time by means of equipment
• Coordinate preventive maintenance activities
• Conducted root cause analyses to determine underlying problems affecting machine performance and reliability.

• Perform preventive maintenance and troubleshoot manufacturing equipment
• Operate all SMT equipment, including DEK printer, Fuji NXT II, Fuji Aimex II, JTU NS Oven and Koh Young SPI machine
• Perform machine set-up for production