Kay Khim Ku
Summary
Proven Lithography technical troubleshooting and problem-solving in team settings. Utilizes effective communication and collaboration to ensure project success. Knowledge of adapting to changing project needs and team dynamics for optimal outcomes.
3 successful wafer fab start up with 2 years overseas understudy at Europe and US fabrication plants. Progress from Associate Engineer to Member of Technical Staff.
Overview
34
34
years of professional experience
Work History
Member of Technical Staff, Fab 7
GLOBALFOUNDRIES
01.2011 - 08.2022
- Driver for Reticle Haze Solutions in Globalfoundries Fab 7. Source, Evaluate, Justify for Purchase, Install Process Tools/Pellicles and Develop Process for Reticle Haze Reduction Operation. Successfully increase Reticle Mean Time to Fail from less than 6 months, 5k wafer counts to more than 2 years, 100k wafer counts, removing Reticle Haze issue as a show stopper in fab operation.
- Optimize Reticle Inspection Criteria, In-house Cleaning Process and out of country service, 95% availability for 24/7 operation eliminating need for back up Reticle set (~USD500k per set)
- Manager for Lithography Line Support Team (30 headcounts). Ensure on time Tool Qualification and improve Tool Qualification Process for Corrective/Preventive/Un-schedule/Power Dip/Fab shutdown maintenance. Success in reducing qualification time through grouping of Tool types and Process Criticality.
- Driver for Rework and Wafer Scrap.
Process Engineer/Integration Engineer, Fab 5
GLOBALFOUNDRIES
01.2001 - 12.2010
- Start up Lithography Process and Technology Transfer with Agere Systems and Bell Labs (140nm to 250nm nodes).
- Setup specifications and train Process Associate Engineers to support 24/7 operation.
- Setup system to enable Agere Systems Reticles to operate in same fab as CHARTERED Reticles (barcode, naming difference)
- Process Integration for Agere Products. Perform Yield Analysis, Failure Analysis and work with Process modules to correct and improve Wafer Yield.
- Transferred to Fab 7 to drive Reticle Haze reduction solutions.
Equipment Engineer, Fab 3
GLOBALFOUNDRIES
03.1996 - 12.2000
- Start up Lithography Nikon Stepper and Reticle Inspection tools (KLA Starlight, HORIBA particle inspection).
- Setup specifications and train team of Associate Engineers to support 24/7 operations.
- Resolution of Reticle ESD issue. Root cause was non ESD compliant material used on Stepper Reticle Library door. Setup routine Quarterly ESD checks with vendor for all tools and material that are in close proximity with Reticles.
- Work with Computer Integrated Manufacturing to auto start Lithography jobs (learning from TECH).
Process Equipment Associate Engineer
TECH Semiconductor (MICRON)
02.1992 - 02.1996
- Pioneer batch to understudy Lithography Equipment at Texas Instruments DMOS IV.
- Start up Canon Stepper, OSI Overlay measurement tool
- Process analysis and disposition of out of specification wafers.
Equipment Associate Engineer
SGS Thomson Microelectronics (STM)
10.1988 - 12.1991
- Understudy at STM Agrate fab, performing maintenance on Canon Proximity Aligner, SVG tracks.
- Maintenance of Proximity Aligner, Tracks, Mask Cleaner and Wet/Dry Etch tools, ensuring optimal performance and minimal downtime.
Education
No Degree - Diploma in Electrical Engineering
Singapore Polytechnic
Singapore06-1986
Skills
- Data proficiency for Problem Solving
- Collaborate well with peers including cross functional teams
- Effective leadership to organize peers towards goals
- Quality Manufacturing mindset
Timeline
Member of Technical Staff, Fab 7
GLOBALFOUNDRIES
01.2011 - 08.2022
Process Engineer/Integration Engineer, Fab 5
GLOBALFOUNDRIES
01.2001 - 12.2010
Equipment Engineer, Fab 3
GLOBALFOUNDRIES
03.1996 - 12.2000
Process Equipment Associate Engineer
TECH Semiconductor (MICRON)
02.1992 - 02.1996
Equipment Associate Engineer
SGS Thomson Microelectronics (STM)
10.1988 - 12.1991
No Degree - Diploma in Electrical Engineering
Singapore Polytechnic
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