JOSE MARI CASTICIMO
Singapore
Summary
Dynamic Process Development Engineer and Assembly Process Engineer committed to continuous learning and professional growth. Passion for innovation drives the pursuit of new knowledge, ensuring effective contributions to team success and organizational goals. Eager to leverage expertise in process optimization and engineering principles to enhance operational efficiency and deliver high-quality results. Dedicated to being a valuable asset through proactive problem-solving and collaboration.
Overview
16
16
years of professional experience
Work History
Senior Engineer (R&D) | CMOS Image Sensor (iBGA)
UTAC Headquarters PTE. LTD.
09.2020 - Current
- Develop, define and characterize new glass attach glue and materials, process parameters and processing conditions for new image sensor packages.
- Developed and characterized glass attach glue, materials, process parameters, and conditions for new image sensor packages to enhance packaging performance.
- Troubleshot and analyzed in-process and reliability failures during new package/device qualification, creating targeted improvement plans to resolve issues.
- Generate technical reports to document and provide conclusions for all the evaluations conducted.
Process Engineer | CMOS Image Sensor
STATS CHIPPAC PTE. LTD.
06.2018 - 09.2020
- Support Process Integration of CMOS Image Sensor assembly line
- Review CIS Materials/Process and provide recommendation
- Performs machine set-up and optimization (Die Attach and Glass attach)
- Implemented projects for process and yield improvement, process elimination, and cost reduction.
Assembly Product Engineer III | Power QFN
AMKOR TECHNOLOGY PHILIPPINES.
01.2017 - 05.2018
- Engaged with design and process review, risk assessment and understood gaps from other devices.
- Prepared tooling, logistics, and materials for device qualification to ensure readiness for production.
- Monitored Frontline (Die Attach, Clip Attach, Wire bond) and Back-End assembly (Mold, Laser Mark, Package Singulation) processes for customer builds and engineering qualification lots.
- Prepares tooling, logistics, and other materials for device qualification.
Assembly Engineer | Military Grade Glass Diode
MICROSEMI SEMICONDUCTOR MANILA PHILS. INC
07.2014 - 01.2017
- Transferred and qualified new assembly products, processes, materials, and equipment.
- Work with Business unit and other functional teams to address/improve production line sustaining issues and lead/drive improvements to meet/exceed goals for Yield, Quality, volume, delivery, equipment maintenance, productivity and Cost.
Process Technician | Image Sensor
TONG HSING ELECTRONICS (PHILS.), INC.
05.2010 - 07.2014
- Led New Product Introduction activities, including design of experiment (DOE) and parameter characterization to enhance product performance.
- Monitored manufacturing processes to ensure compliance with specifications, reducing lot rejections and defects.
- Implemented projects focused on process and yield improvement, streamlining operations and reducing costs.
- Conducts training, certification and qualify newly hired operators and technicians.
Education
BS - Electronics and Communications Engineering
Cagayan State University
Tuguegarao City, Cagayan, Philippines04-2009
Timeline
Senior Engineer (R&D) | CMOS Image Sensor (iBGA)
UTAC Headquarters PTE. LTD.
09.2020 - Current
Process Engineer | CMOS Image Sensor
STATS CHIPPAC PTE. LTD.
06.2018 - 09.2020
Assembly Product Engineer III | Power QFN
AMKOR TECHNOLOGY PHILIPPINES.
01.2017 - 05.2018
Assembly Engineer | Military Grade Glass Diode
MICROSEMI SEMICONDUCTOR MANILA PHILS. INC
07.2014 - 01.2017
Process Technician | Image Sensor
TONG HSING ELECTRONICS (PHILS.), INC.
05.2010 - 07.2014
BS - Electronics and Communications Engineering
Cagayan State University
SUMMARY OF SKILS AND QUALIFICATION
- Over 16 years of experience in the area of Semiconductor Assembly Engineering
- Known for exceptional work ethic, strong integrity.
- Self-motivated and willing to take initiatives.
- In-depth knowledge in Wafer dicing.
- Process development for CMOS Image sensor, Power QFN and Hermetic glass diode package assembly.
- Knowledgeable in Wafer Back grind and Laser Saw Process(DISCO Platform)
- Knowledgeable in the process engineering aspect of assembly equipment such as die attach, glass attach(ESEC 2100 sD advanced i and ASM ISLinda.
- Knowledgeable in different engineering analytical tools, concept and principle
- Knowledgeable in JMP SAS application.