My goal is to become associated with a company where I can utilize my skills and gain further experience while enhancing the company's productivity and reputation.
Machines Handled:
• Die Pick and Place: BESI Datacon 8800 Chameo
• Annealing Oven: Duocom HS-3640
• Mold Machine: YAMADA WCM-300L
• Dieshift and Warpage: NIKON OCDM300mm Recon
• Taping: NITTO DENKO DR3000e & 4000wS
• Debonding: DYNATECH DT-W082050A
• Edge-rounding: DISCO DFD6361