John Derek D. Arcebal

Silicon-based solar cells fabrication and characterization (ECV, SE, QSS-PC, SR, PL, IV, TLM etc.).

• Focused on on thin film and wet chemistry applications: doped poly-Si (LPCVD), patterning of doped poly-Si, passivation stacks (PECVD), optical properties of conductive oxides (ALD)

1.1 Process control of layer deposition steps;

-includes lifetime test samples that capture step-wise induced factors that influence device performance:

1.2 Optimization of Diffusion recipes thru detailed DOEs (Design of Experiments);

1.3 Fine-tuning wet chemistry steps for controlled patterning and improved layer uniformities;

• Step-wise characterization of cell precursors including process monitoring test samples:

2.1 Doped poly-Si characterization: sheet resistance (4PP), doping profiles (ECV), layer thickness and optical properties (spectral ellipsometry, SE);

2.2 Checking cell precursor lifetime and quality prior metallization: QSS-PC and Photoluminescence imaging (calibrated lifetime mapping)

2.3 Checking final cell performance via IV measurements;

2.4 Post cell analysis which includes: Spectral response (SR) measurements to check cell quantum efficiency (EQE) and current loss breakdown; metal finger contact (TLM).

• Perform fingerprint tests essential to pre-acceptance reports of various hazardous wastes
• Supervise solid waste stabilization process for incineration and cement fixation
• Provide technical assistance in proper treatment of hazardous industrial waste
• Lead and supervise laboratory operations

• Leader: Quality Control/R&D lab operations
• Trained and supervised laboratory analysts
• Established continuous improvement projects to existing laboratory SOPs
• Provided technical support essential to optimum process operations
• Performed R&D and cost reduction activities
• Migrated key methodologies from Japan lab headquarters Singapore site as the start-up engineer: pretreatment, analytical instrumentation; optimized use of ICP-OES and ED-XRF essential in precious metals quantification.

Metals Laboratory: Silicon Wafer Fab

• Led start-up, qualification and gauge study (MSA/GRNR) of ICP-MS NexION 300S
• Established 21 trace metals analysis as FA tool for wet etch processes (Al, As, Ca, Cr, Cu, Fe, Mg, Na, Ni, Pb, Ag, Cd, Ba, Be, Co, Cs, Mn, Sr, V, U and I)
• Led tool capability studies of ICP-MS Elan II and ICP-MS NexION
• Supported wet etch processes cost reduction projects
• Performed daily calibration and operation of ICP-MS and first hand tool maintenance and optimization whenever need arises
• Ensured timely feedback of results to customers, minimizing production loss and increased Customer Satisfaction Metrics (CSM)

Plating Laboratory: Copper and Tin Plating Lines

• Led lab analytical support needed for new chemistry for Cu plating baths
• Established a 50% NaOH pellets usage reduction in additive analysis of a new Cu stripping chemistry (recognized as best known method)
• Co-led modification of UV-Vis spectrometer Calibration Curve (% → ml/L) for a Sn bath additive analysis
• SPECS Owner for Plating Analyses Procedures
• Supported Plating R&D innovative and cost reduction projects