JUN FATT SOH

• Calibrate and optimize wire bond equipment settings in collaboration with process engineers to improve yield and throughput
• Develop, modify, and fine-tune wire bonding machine programs and recipes for new and existing products, ensuring smooth transfer between platforms (e.g., migrated recipes from Memplus to Rapidmem for standardization)
• Monitor production data and SPC charts to identify process trends, implement corrective actions, and maintain robust process control
• Conduct experiments and in-depth data analysis using JMP to troubleshoot bonding issues and drive continuous improvement
• Investigate and resolve wire bonding defects such as short tails and Non-Stick on Pad (NSOP) issues through systematic problem-solving and parameter optimization (refining Bond1 parameters)
• Collaborate with cross-functional teams (NPI, Production, Equipment Engineering) to qualify new materials and equipment upgrades, including the successful full conversion to TERA capillaries across all device types
• Train operators and technicians on new processes, equipment calibration, and best practices to ensure smooth adoption and adherence to procedures

Key Achievements:

• Yield Improvement: Optimized wire bonding loop parameters to reduce die-to-die short-tail defects, significantly improving bond yield
• Throughput Enhancement: Increased wire bonding throughput to 9.5 wires per second by fine-tuning machine parameters, boosting productivity and output
• Process Standardization: Streamlined operations by proliferating bonding recipes from Memplus to Rapidmem platforms, reducing setup time and ensuring process consistency across machines
• Quality Optimization: Resolved chronic NSOP (Non-Stick on Pad) issues by adjusting first bond parameters, enhancing overall bond quality and reliability
• Equipment Upgrade: Led the implementation of TERA cap conversion for all product lines, resulting in more consistent bonding performance and ease of maintenance

• Led a team of wire bond operators to meet daily production targets while maintaining strict quality standards in semiconductor assembly
• Monitored wire bonding processes on the production floor and performed first-level troubleshooting to minimize equipment downtime and scrap
• Coordinated with process engineers to introduce new bonding parameters and materials, contributing to improved throughput and yield
• Trained and mentored new operators on standard operating procedures (SOPs), machine operation, and safety protocols to build a skilled team

• Operated automated wire bonding machines for semiconductor device packaging, following detailed work instructions and safety guidelines
• Performed routine equipment checks and basic preventive maintenance on wire bonders to ensure optimal performance and reduce downtime
• Conducted visual inspections of wire bonds (e.g., bond placement, loop height, tail length) to verify quality and adherence to specifications
• Consistently met or exceeded daily production quotas by maintaining high equipment uptime and efficient work practices
• Collaborated with maintenance and engineering teams by promptly reporting issues and assisting in implementing process improvements on the manufacturing floor