Edward Fontanilla

30+ years hands-on assembly operation engineering, new business development, product and technology marketing experience, leading programs from packaging design concept, NPI, qualification, low volume, to high volume production in assembly and test operation. Proven leadership expertise in OSAT and MNC operation, supply chain management, technical program management, project management, product management, people management, process engineering, and quality management, package development, and technology management. Extensive knowledge of advanced packaging solutions, power IC's, lead frame, ceramics and laminate-based packages, wafer services, WLCSP, wafer bumping, and assembly NPI. Handled various market segments in semiconductor industry such as computing, commercials, communications, aerospace and defense, automotive, industrial, medical, memory, military, transportation, networking, RF, and IoT. Deep experience on different new processes and technologies such as in wafer technologies (different Si nodes, GaAs, GaN, Sapphire, etc), new process technologies (cu bonding, d2d, stacked die, stealth dicing), die bonding (soft solder, new epoxy, die attach film), molding techniques (transfer and compression), solder ball mounting, hot solder dip, and lead finishing. A strategic leader with passionate heartbeat in building new team and growing business in tandem. Believe in optimizing individual talent, teamwork, and collaboration as critical elements of success. Specialties and Core Competencies: Technology and Product line management, market analysis, and product portfolio management. Sales and customer relationship management, collaboration, and engagement. Hands on experienced in assembly and test operation engineering, from front to back end process both for wafer level, lead frame and substrates-based products with expertise on wafer probing, back grinding, sawing, die bonding, wire bonding, and molding, marking, plating, ball attach, and singulation level process. New product introduction and product transfer (inter site, site to site, customer to site). Strong in problem-solving, data analytic, and critical thinking skills with expertise on 8D, FA, RCA, DOE, FMEA, FDC, SPC, 5S, and Kaizen. Strategic and tactical executions for new products and technology development. Drive packaging and technology roadmap. Lean six sigma DMAIC problem solving and manufacturing cost reduction project expert. MS excel data visualization and data analysis with Pivot Tables, MS Excel Dashboards, MS Power BI, SAS JMP, and ESDA. Strong communication, technical reporting and presentation skills. Interpersonal relationship skills including negotiating and customer relationship management. Project management professional, waterfall, and agile methodologies. P&L, Budgeting, Engineering Prototyping, Purchasing, IT (Automation), Program Management, Quality, and Manufacturing Operations.

Equipped with strong problem-solving abilities, willingness to learn, and excellent communication skills. Poised to contribute to team success and achieve positive results. Ready to tackle new challenges and advance organizational objectives with dedication and enthusiasm.

• Nationality: Singaporean
• Marital Status: Married