Charmaine Wee

Micron Semiconductor

09.2020 - Current

Went on EIBT to Fab 4 to transfer 170s FOAK workstation. Collaborated with F4 wet process to solve FOAK workstation issues. Display technical knowledge and established new CWAC cycle frequency to improve manufacturing throughput by 150 wfrs/week.
Extensive collaboration with EHS, Fab support, IE, Layout team, and Tool install team to ensure 170s FOAK Bevel Dep tool installation is on track.
Awarded the Micron Innovation Award for the development of the 160s Triple B flow with RegE team.
Collaborated with vendors/OCT and led bevel arcing task force to introduce first-of-a-kind technology - bevel etch pulsing process to Micron to completely eliminate 160s bevel etch arcing. Scrap reduction from 3% per week to 0%.
Published STSFE paper in 2023 to showcase the new bevel pulsing technology.
NTI ATM Culture Champion - Collaborate with PI and RegE to enable Turtle Flow V1/V2 timely to realize gain in Cost ($48M CAPEX Avoidance), Line (98% carbon peeling gain) and C1 Yield (1.5% 22UE improvement).
Collaborated with Fab 4 and various stakeholders to ensure smooth 160s technology transfer on the following workstations: Dry Strip, Backside Wet Strip, Bevel Dry Etch, and Bevel Wet Etch.
SME for Backside Wet Strip and Dry Strip Workstation.