Working in the feild of precise Engineering seminconductor with more than 18 years of experience at different modules such as wire bond , die attach and other front end semiconductor manufacturing . Currently working as a technologist in diffusion Manufacturing . Responsible for Furnace Equipment preventive maintenance , Corrective maintenance and schedule maintenance as required from process team. As people leader Responsible for Train Equipment technician on Tool Maintenance and safety procedures
Responsible for SPC EPC reports for FOL assembly process wire bond tools Tools handled for failure analysis Universal Bond tester Die shear tester Wirepull tester Profile projector
Perform Tool setup, preventive maintenance, corrective maintenance on die bonders such as ESEC 2007,2008, 2008 xp Perform Tool setup preventive maintenance and corrective maintenance on wire bonders KULICKE & SOFA 8020,2028 and shinkawa UTC -1000
Technical and Soft Skills : In-depth knowledge in wafer fabrication processes and familiarity with various fabrications techniques and tools Familiar in Electrical circuits in equipment all type of sensor and its functions gas chambers and flow controllers (MFC) Leak detector functions Soft skills Excel power Bi Sap Tools
Be a part of indias semiconductor vision and mission and Enhance my opportunity