Chanapha Lapha

1.Etching Fab Operator (Wet and Dry skills)

-Setting up, operating, and monitoring etching equipment (wet and dry etch).

-Loading and unloading wafers into the equipment.

-Inspecting etched wafers for defects and ensuring they meet quality standards.

-Performing visual inspections and using measurement tools to verify etching accuracy.

-Maintaining a clean and organized work area in the cleanroom.

-Following safety protocols and procedures for handling chemicals and equipment.

2. Epitaxy SIC Fab Operator

-Qualification of Tokyo Electron Ltd reactor machines

for Silicon carbide Epitaxy project.

-Qualification of metrology tools status nano Innovation, semilab MCV for thickness and dopant measurement.

-Work together with facilities and teams for new clean room setup.

-Experience in operating SCREEN scrubber tool for DIW clean of Silicon carbide wafers.

-SPC chart monitoring and dopant and thickness measurements

-Recipe fine tuning to achieve thickness and uniformity during daily operation of production.

3. Epitaxy ASM Fab Operator (6”&8”)

-This involves setting up, operating, and maintaining equipment used for epitaxial growth.

-Preparing substrates (wafers) for epitaxial growth, including cleaning, inspection, and loading/unloading them into the growth equipment.

-Following established procedures to perform epitaxial growth, monitoring process parameters, and collecting data.

-Entering observations, process parameters, and data into a database, and maintaining accurate records of process parameters.

-Maintaining a clean and organized work environment, adhering to cleanroom protocols and safety regulations.

-Working closely with engineers, technicians, and other operators to ensure smooth and efficient operations.

-Assisting in the development and improvement of epitaxial growth processes and procedures.

-Following all health, safety, environmental, ergonomic, and cleanroom requirements.